TTV heating block
The TTV heating block adopts a thick film heating process, with a maximum power density of 300W/cm ². The substrate is made of aluminum nitride material, with high thermal conductivity and strong pressure bearing capacity. The TTV heating block can simulate the working state of chip heating by inputting voltage through the heating block.
The TTV heating block adopts a thick film heating process, with a maximum power density of 300W/cm ². The substrate is made of aluminum nitride material, with high thermal conductivity and strong pressure bearing capacity. The TTV heating block can simulate the working state of chip heating by inputting voltage through the heating block.
Features:
- Small size, high heating power, maximum power density up to 300W/cm ²
- Special metal sintering and heating process, with strong temperature resistance and high reliability
- Aluminum nitride load-bearing substrate with high thermal conductivity, strong compressive performance, and uniform temperature
- Uniformity and non-uniformity design to meet the needs of multiple heat sources
- Infinite adjustment of heating power, integrated with temperature and power display
Application:
- Simulate heat source heating
|
Power (W) |
Voltage (V) |
Resistance（Ω）@20~25℃ |
Size （mm） |
Heating area（mm） |
Power density（W/cm2） |
|
200 |
220 |
242±5％ |
43*25*2.5 |
25*25 |
32 |
|
250 |
220 |
193.6±5％ |
74*50*3 |
50*50 |
10 |
|
550 |
220 |
88± 2% |
115*62*3 |
78.46*31.1 |
22.54 |
|
800 |
220 |
60.5 ± 2% |
49.2*32*3 |
32.3*25.6 |
96.75 |
|
1000 |
220 |
48.4±5％ |
74*50*3 |
50*50 |
40 |
|
1500 |
240 |
38.4±2% |
49.2*35*3 |
23.9*29.36 |
214.2 |
|
2500 |
220 |
19.36 ± 2% |
74*50*3 |
48.6*48.2 |
106.72 |
|
2500 |
220 |
19.36±2% |
49.2*35*3 |
32.3*25.6 |
300 |
