High-Precision Electronic Device TEC Module

The high-precision electronic device TEC module consists of a TEC core unit, integrated heat dissipation components, and control & sensing systems. The TEC core is composed of multiple pairs of P-type and N-type semiconductor materials arranged in an S-shaped circuit. When powered, the control and sensing system drives the TEC to operate, adjusting the current direction to switch between cooling and heating. The hot side of the TEC dissipates heat through a liquid cold plate or heat sink fins, while the cold side is in direct contact with the target device, enabling precise closed-loop temperature control.

Product Features:

◆Active semiconductor thermoelectric cooling technology (TEC).

◆Integrated temperature sensor for real-time monitoring and precise temperature control; high stability and accuracy.

◆Microchannel flow path design with advanced fin technology to control TEC hot side temperature.

◆Customizable cold side dimensions to match the size of the heat source.

◆Ideal for high-precision instrument cooling and accurate temperature regulation.

High-Precision Electronic Device TEC Module Technical Specification：