Hard Drive TEC Module (TEA Module)

The Hard Drive TEC Temperature Control System, also known as the Hard Drive TEA Module, is specifically designed to manage the temperature of storage hard drives in communication servers. The module consists of the following main components: two semiconductor TEC cooling chips, a hot-side heat dissipation substrate, a cold-side heat dissipation substrate, and a cold-side temperature sensor. It also includes auxiliary components such as mounting adapters, thermal insulation materials, sealing materials, cable sleeves, and connectors.

When powered, the TEC chips actively cool one side while the other side generates heat. The cold side contacts the hard drive through thermal interface material, while the hot side dissipates heat through thermal materials to the module housing. In extremely cold environments, reversing the power to the TEA module can warm the hard drive, restoring it to an optimal operating temperature and ensuring reliable performance.

Product Features:

◆Active semiconductor TEC cooling technology for precise temperature control. Dual-function: capable of low-temperature cooling and high-temperature heating.

◆Direct-contact thermal management; compact and lightweight design.

◆Copper substrate with nickel plating for high thermal conductivity.

◆No moving parts, ensuring high reliability and long lifespan.

◆Integrated NTC temperature sensor for accurate monitoring.

Hard Drive TEC Module Technical Specification: