L10/L11 Thermal Interface Material Curing Equipment

The L10/L11 Thermal Interface Material Curing Equipment is specifically designed for curing processes in liquid-cooled servers (L10) and rack-level liquid-cooled systems (L11) prior to testing. It supports simultaneous curing of two racks or two individual nodes. The system integrates temperature, pressure, and flow sensors and is equipped with a 25 µm precision filter. It provides a flow rate range of 1 to 162 L/min with a control accuracy of ±1%. Rack interfaces use 2-inch clamp connections, while node interfaces adopt UQD04 quick-disconnect couplings, ensuring simple and efficient operation.

The system is controlled by a Siemens PLC, allowing flexible configuration of curing duration and acceptance criteria according to the product under test. It features a 7-inch display and a 12.1-inch LCD monitor for real-time parameter monitoring and result evaluation. The integrated computer is pre-installed with host software capable of communicating with client ATE (Automatic Test Equipment) programs via a standard RJ45 interface, using Modbus TCP/IP as the default communication protocol.

PRODUCT FEATURES:

◆Dual-channel design enables simultaneous heating and curing of two server racks or two nodes.

◆Inlet and outlet ports feature chuck-type or quick-connect fittings for easy installation and maintenance.

◆SUS304 stainless steel piping ensures durability and corrosion resistance.

◆High-power heater supports rapid preheating and stable temperature control.

◆7-inch and 12.1-inch displays enable convenient data reading and parameter configuration.

◆Supports PLC and host software control with integrated monitoring of pressure, temperature, and humidity.

◆Built-in alarm system assists maintenance personnel in quickly identifying and resolving system anomalies.

TECHNICAL SPECIFICATION FOR TIM CURING EQUIPMENT: