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DIMM cold plate

Memory Module Cold Plate
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Details

The memory module cold plate assembly consists of the CPU cold plate, memory module cold plate, inlet and outlet piping, quick connectors, and thermal interface materials. The memory module cold plate is manufactured from stainless steel. When the coolant flows through the internal channels of the cold plate, it absorbs the heat generated by the memory modules, thereby controlling their temperature. The cold plate is fabricated using brazing technology and paired with specially selected thermal interface materials to ensure overall reliability and maintain the memory module’s insertion and removal durability.

 

PRODUCT FEATURES:

SUS304 stainless steel and copper with brazing process for high reliability.

Internal flow channel design with low flow resistance and excellent heat dissipation performance.

Special thermal interface pads, capable of over 300 insertion/removal cycles without damage.

Integrated bracket design for easy installation.

100% ultrasonic CT inspection for quality control.

100% air tightness, flow resistance, and cleanliness testing.

100% liquid draining and drying, with nitrogen protection.

 

MEMORY MODULE COLD PLATE TECHNICAL PARAMETERS:

Cooling Target

CPU+Memory Modules

CPU Thermal Power

350Wx2

Memory Module Thermal Power

15Wx32

Mounting Method

Combined Screws

Cold Plate Material

SUS304+Copper T2

Coolant

PG25

Connection Pipe

EPDM

Design Pressure

6Bar

Test Flow Rate

1.5LPM

Pressure Drop

27.4kpa@1.5L/min

Thermal Resistance

0.037W/℃

Inlet Temperature

45℃

Thermal Interface Material

5.5W/m·K

Connector

UQD04 Socket