DIMM cold plate
The memory module cold plate assembly consists of the CPU cold plate, memory module cold plate, inlet and outlet piping, quick connectors, and thermal interface materials. The memory module cold plate is manufactured from stainless steel. When the coolant flows through the internal channels of the cold plate, it absorbs the heat generated by the memory modules, thereby controlling their temperature. The cold plate is fabricated using brazing technology and paired with specially selected thermal interface materials to ensure overall reliability and maintain the memory module’s insertion and removal durability.
PRODUCT FEATURES:
◆SUS304 stainless steel and copper with brazing process for high reliability.
◆Internal flow channel design with low flow resistance and excellent heat dissipation performance.
◆Special thermal interface pads, capable of over 300 insertion/removal cycles without damage.
◆Integrated bracket design for easy installation.
◆100% ultrasonic CT inspection for quality control.
◆100% air tightness, flow resistance, and cleanliness testing.
◆100% liquid draining and drying, with nitrogen protection.
MEMORY MODULE COLD PLATE TECHNICAL PARAMETERS:
|
Cooling Target |
CPU+Memory Modules |
|
CPU Thermal Power |
350Wx2 |
|
Memory Module Thermal Power |
15Wx32 |
|
Mounting Method |
Combined Screws |
|
Cold Plate Material |
SUS304+Copper T2 |
|
Coolant |
PG25 |
|
Connection Pipe |
EPDM |
|
Design Pressure |
6Bar |
|
Test Flow Rate |
1.5LPM |
|
Pressure Drop |
27.4kpa@1.5L/min |
|
Thermal Resistance |
0.037W/℃ |
|
Inlet Temperature |
45℃ |
|
Thermal Interface Material |
5.5W/m·K |
|
Connector |
UQD04 Socket |
