CPU/GPU Cold Plate

The CPU/GPU cold plate consists of the main body, inlet and outlet pipelines, quick connectors, and leak detection components.It adopts micro-channel skiving combined with vacuum brazing technology.Pure copper is used as the heat transfer base material, together with an optimized flow channel design, to achieve high heat transfer efficiency with low flow resistance and low thermal resistance.   

PRODUCT FEATURES：

◆ Optimized flow channel design with low resistance and no risk of flow-induced erosion and corrosion.

◆ Integrated drainage tray and leak detection system at connection points for enhanced safety.

◆ High-purity copper material with skiving process for excellent thermal conductivity and low thermal resistance.

◆ Vacuum brazing process ensures excellent pressure tolerance  and long-term reliability.

◆ Over 95% brazing coverage on bonding surfaces, ensuring leak-free operation.

◆ 100% ultrasonic CT inspection for strict quality control.

◆ Special acid pickling and passivation treatment inside flow channels for enhanced corrosion resistance.

◆ 100% testing for air tightness, flow resistance, and cleanliness.

◆ 100% drainage, drying, and nitrogen protection

CPU COLD PLATE TECHNICAL PARAMETERS：