GB200 NVL72 Emulator consists of an OPC ORV3 Rack, 18 2U TTV load banks, 1 system control module, and a flow control module, enabling full rack thermal power simulation.
Provide a comprehensive solution for achieving processing capabilities such as pressure holding, liquid injection, baking, drainage, drying, and nitrogen injection during the production and testing process of liquid cooled server products.
The server phase change evaporative cooling system utilizes a cooling medium with high insulation performance and moderate boiling point to remove heat from the heat source through the latent heat of vaporization when the fluid boils, in order to achieve cooling of the heating components.
The switch liquid cooling solution is designed for standard 1U switches, integrating Mac chip liquid cooling, double-layer optical module contact liquid cooling, and freely configuring liquid cooling for other modules to achieve complete cabinet liquid cooling.
The liquid cooled cabinet solution adopts standard EIA or ORV3 server cabinets, integrating Manifold, PDU/Basbar, rack mounted CDU, and liquid cooled back panel doors to achieve liquid cooling of the entire cabinet.
